Deep Transfer Learning for Computer Vision

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Chip and equipment manufacturing and tracking is a tough task given the strict adherence to quality standards and processes like six-sigma control checks. In this session, we will be looking at key real-world problems from Semiconductor & Manufacturing, and possible methodologies where we leveraged a combination of traditional computer vision techniques and coupled it with the power of deep transfer learning and machine \ deep learning. We will be covering two main use-cases from the Industry:


Automatic Defect detection at Nanoscale

Defect Clustering at Nanoscale

This talk has been presented at ML conf EU 2020, check out the latest edition of this Tech Conference.

FAQ

The talk focuses on deep transfer learning for computer vision, specifically in the context of semiconductor manufacturing at nanoscale.

The speakers are Dipanjan, a data science lead at Applied Materials and a Google Developer Expert in Machine Learning, and Sachin, who leads the data science competence from Bangalore at Applied Materials.

Moore's Law states that the number of transistors on a microchip doubles approximately every two years. This is relevant to semiconductor manufacturing as it drives the need for advanced atomic-level engineering and defect detection.

AI helps in defect detection by leveraging techniques like deep learning and transfer learning to identify and classify defects in semiconductor wafers, thus saving time and costs.

Common defects include particle defects, large particles, small particles, and other variations, which require multiple classifiers and image processing techniques to identify and classify.

Transfer learning is used to fine-tune pre-trained models like ResNet to extract deep features and combine them with traditional image-processing features for effective defect classification.

Image augmentation is used to enhance the dataset, especially when dealing with limited data, by creating variations of existing images to improve model training.

The AI model for defect detection achieves a holistic performance of 95% across four types of classifiers, with detailed performance metrics for each specific classifier.

Unsupervised learning is used when there is no prior knowledge of defect types. It involves clustering algorithms to group similar defects and identify outliers, making the process reproducible and repeatable.

The clustering techniques mentioned include agglomerative clustering and affinity propagation clustering, which help in forming clusters and identifying outliers.

Dipanjan Sarkar
Dipanjan Sarkar
Sachin Dangayach
Sachin Dangayach
8 min
02 Jul, 2021

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Video Summary and Transcription
The video focuses on deep transfer learning for computer vision, specifically in the semiconductor manufacturing industry. It covers defect classification using multiple classifiers and image processing techniques. The video explains the use of a hybrid classification system with pre-trained models and image augmentation for defect detection. It also explores unsupervised learning methods, leveraging clustering algorithms and pre-trained models like ResNet-50 for defect analysis. The benefits of using pre-trained models such as ResNet in this industry are discussed, highlighting improved accuracy and reduced development time. High-resolution images are crucial for accurate defect detection, and the performance of AI systems is evaluated through precision metrics. The talk also delves into the technique of stacking in defect classification to enhance accuracy.

1. Introduction

Short description:

Today's topic is deep transfer learning for Computer Vision, with a focus on real-world applications in the semiconductor manufacturing industry. Dipanjan and Sachin will share their expertise in this field.

Hi, everyone. So, today we will be talking about deep transfer learning for Computer Vision, and we'll be covering a couple of real-world applications in the context of the semiconductor manufacturing industry at nanoscale.

A bit about ourselves, so I'm Dipanjan. I'm a data science lead at Applied Materials, also a Google Developer Expert in Machine Learning and an author. Over to you, Sachin.

Thanks, Dipanjan. Hi, everyone. My name is Sachin. I lead the data science competence from Bangalore in applied materials. I have an experience of more than a decade handling multiple enterprise-wide use cases. And in this particular scenario, we'll be discussing about semiconductor industry related AI use cases. So let's jump into it, Dipanjan.

2. Defect Classification

Short description:

Today's topic is defect classification in semiconductor manufacturing. We leverage multiple classifiers to identify defects and apply image processing techniques to analyze the defects. Dipanjan explains how we use a hybrid classification system with pre-trained models and image augmentation for accurate defect detection and classification.

Okay, so today we are going to talk about defect classification. So I think all of us know about Moore's law, where it states like every two years that transistors in a chip gets doubled. And how it is possible, like it is possible by the atomic level engineering, what companies like applied the day in day out they do. And for that, they need to develop these recipes. And these recipes are not easy to develop.

The process engineers who work on these recipes have to deal with lot of defects while refining these recipes. They deal with these high end image capturing techniques, which these tools like laser tech and AFM, which is Atomic Force Microscopic Tech tools, are taken into account. And in these particular cases, some of these techniques are very destructive where the wafers are destroyed. That's where AI can help by figuring out these defects and have a lot of cost savings and time savings.

So I'll give you a quick overview of how we are leveraging AI techniques and defect detection for AI semiconductor manufacturing. So if we talk about the defects, like we deal with multiple type of defects. In this particular use case, we have defects like particle, large particles, small, fit and all. You can see there is a lot of noise and variation. So it was not easy to have one single algorithm or one single model to deal and find the whole classification done. What we have done here is we leverage multiple classifiers, a stacking technique where we input the image. Then we do a lot of image processing to different techniques. We do the denoising and then we feed that image into first level of classifier, which figures out whether there is a defect or not. If there is a defect, then we try to figure out the second level of classifiers, whether it's unknown, or a large, or a small defect.

Even if we find that, then there are different types of image processing techniques we apply to bring that effect out of the background. Then we try to do further analysis, like whether there is noise or the threshold levels are ... The noise levels are below threshold so that we can directly go to the fourth level of classifiers, which are to decide the ultimate class, whether it's a pet or a particle. In this way, we try to leverage transfer learning-based techniques to figure out the classification approach, what we have got.

So, I think Dipanjan will get more deeper into it and we'll ... Over to you Dipanjan. Here, we try to apply a hybrid classification system where we fine-tune a pre-trained ResNet model to extract the deep features. We also use traditional image-processing-based features like gray-level co-operance matrices and zonic moment features. We combine these to form a fusion feature vector, and we pass it through a deep learning net to do the final level of classification. And we also do some image augmentation, especially in cases where we have less data, just like in these cases, because we can't afford to have a lot of data, especially with regard to semiconductor-level electron microscope-level scans. And we also leverage pre-trained models like ResNet-50 in the backend of a object-detection model like a faster RCNN to detect and count the number of defects, because sometimes you also have to give the defect count besides the type of defect. With regard to our evaluation performance, as you can see, the performance is 95 percent on a holistic overview in terms of the four types of classifiers, and we do a per-classifier level performance also to understand the level of performance we are getting at each specific hierarchy in our overall hierarchical classification system.

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